1. The development of the semiconductor industry
Troughout the time axis of global semiconductor industry development, seven major time nodes can be divided: ① The transistor era and the birth of IC in the 1940s and 1950s, the emergence of the original computer and the large demand for military industry gave birth to the original semiconductor industry; ② In the 1960s, silicon based circuit design gradually developed, making IC manufacturing enter the mass production stage and IC enter the commercial stage; ③ In the 1970s, personal computers appeared and large-scale integrated circuits entered the civil field; ④ In the 1980s, with the popularization of PC, the whole industry was basically developing around PC, especially the semiconductor memory and microprocessor, and the industry entered the civil stage; ⑤ In the 1990s, PC entered a mature stage; ⑥ In the first 10 years of the 21st century, the Internet was widely promoted, the network foam and the mobile communication era came, and consumer electronics replaced PC as the new driving factor of the semiconductor industry; ⑦ Since 2010, with the arrival of the big data era, the semiconductor industry has experienced a slowdown and gradually matured.
Semiconductor is the core of many industrial complete equipment, widely used in computer, consumer electronics, network communications, automotive electronics and other core fields. Semiconductors are mainly divided into four parts: integrated circuits, discrete devices, optoelectronic devices, and micro sensors. Integrated circuits can be divided into microprocessors, logic ICs, memories, and analog circuits according to their functions. Among them, integrated circuits account for more than 80% of the whole market, which can be divided into computing, storage and analog integrated circuits according to their functions.
Semiconductor materials and semiconductor equipment are the semiconductor support industry. Under the complex international trade relations, they have become the top priority and also the key link of domestic containment. According to SEMI, the global semiconductor material market size will reach 58.7 billion US dollars in 2021, and the semiconductor equipment market size will reach 95.3 billion US dollars. Benefiting from the strong demand in data center, 5G, automatic driving, AI and other fields, the wafer OEM market grew rapidly, and the proportion of advanced manufacturing processes increased rapidly. IC Insights data shows that the global wafer OEM market will exceed 100 billion dollars for the first time in 2021, and will grow to 125.1 billion dollars in 2025. In the post-epidemic era, the digital transformation of society was accelerated; Under the background of carbon neutrality, the automobile electronization is unstoppable, and the downstream demand is strong to promote growth. According to the latest prediction of WSTS, the global semiconductor market will reach 552.9 billion US dollars in 2021, with a year-on-year growth of 26%; It will further increase by 9% to USD 601.4 billion in 2022.
2. The application of HK-EX motion controller and HK-MXB EtherCAT IO on Die Bonder
The Die Bonder, also known as the chip mounter, is a device for fixing crystals and semiconductor packaging. It is mainly used in the lead cabinet frame pressing plate of various gold wire ultrasonic welding equipment, as well as the die attach link in the semiconductor packaging test stage. That is, the chip is grabbed from the cut Wafer and placed on the corresponding Die flag of the placode, and the chip and the placode are bonded by elargol (Epoxy).
The following figure shows the network topology of Hongke Die Bonder. Hongke HK-EX series high-performance motion controller and HK-MXB series economical EtherCAT IO module are used in this application project to collect data from sensors and industrial cameras and control solenoid valves.
3. HongKe HK-EX series high performance motion controller
CODESYS soft PLC solution is adopted, which supports IEC61311-3 standard, and can support the movement of up to 128 servo axes in 1ms scanning cycle. It has accurate real-time performance, and can realize motion control, logic control, process control, robot, CNC and other applications on one platform. It is the best choice for industrial equipment controllers.
4. Hongke HK-MXB series economic EtherCAT IO module
The integration of digital input and output mixing can provide an ideal channel for higher level EtherCAT master station controllers. 24V NPN/PNP digital logic input signals are used in industrial fields, and the captured signals are protected by current limiting and electrical isolation.
